This ebook addresses computationally-efficient multi-objective optimization of antenna buildings utilizing variable-fidelity electromagnetic simulations, surrogate modeling options, and layout area aid equipment. in accordance with modern study, it formulates multi-objective layout initiatives, highlights comparable demanding situations within the context of antenna layout, and discusses answer ways.
Extra resources for Anti-Fatigue Design and Manufacturing Technologies I
This fact minimizes the residual stresses in the films and the substrates near the interface, thus diamond coatings with strong adhesion can be fabricated . In present study, scratching pretreatment is adopted for SiC substrates to roughen the surfaces in order to increase the nucleation, and then diamond films are fabricated on the inner surfaces of SiC compacting dies in an HFCVD apparatus. Thereafter, some as-deposited diamond films are polished with diamond grits (1 µm). For the characterization, the SEM, surface profiler, Raman and XRD Spectroscopy are adopted.
24 kPa. The MRR decreased greatly when BTA is used as inhibitor. The ideal inhibitor should not reduce the MRR greatly and reduces the etch rate to a great extent. min-1 18 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 Imidazole Concentration /mM Fig. 05 0 1 2 3 4 5 Imidazole Concentration /mM Fig. ) The effect of imidazole concentration on the MRR and SER is shown in fig. 8 and fig. 9, respectively. The MRR and SER decease with imidazole concentration increasing and the difference between the MRR and the SER is obvious, indicating that imidazole in the slurry is advantageous to the formation of passive film on the surface of Ru disk and the mechanical effect play a very important role in the CMP process.
This paper presented a finite element simulation model for the analysis of AISI D2 orthogonal cutting process using TiAlN coated inserts. Firstly, AISI D2 material constitutive model was built based on power law model, which was used in the FEM codes to describe the effect of strain, strain rate and temperature on the material flow stress. In modeling the chip formation, a damage model was employed to predict the chip separation. Then cutting edge radius and thickness of TiAlN coating of cutting tool were measured by SEM.
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